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In the SMT department, latest generation installations and machinery are managed by highly qualified and constantly updated staff. The assembly of SMD components the most advanced technologically on hand today, from the minute 0201 to the QFP with 0.4mm pitch, BGA, uBGA, CSP and “ODD-FORM” takes place in an EDS protected environment.


     

           
           

 

The production line can accommodate up to 240 feeders  at 8 mm, this way offering various advantages; it is possible to assemble print circuit boards with many codes, using only one setup, introducing redundancy dedicated to multipicking. All of this is an advantage in the quality and production performances.

The flooring of the warehouse and the entire production area is made of certified conductive material; all the furnishing is antistatic in compliance with the strictest of regulations, another confirmation of our research excellence in every detail.
 

Currently the three production lines are equipped with ovens for the forced hot air recast already functioning in an inert atmosphere, through the injection of nitrogen. They are made up of opposing heating elements that allow the heat to spread with maximum efficiency and uniformity over the entire surface of the print circuit board. The cooling is carried out through an active exchange system that allows the better removal of heat of the soldered print circuit board. This way it is possible to make very precise temperature profiles regardless of the thermal load at stake. Every temperature profile is studied and validated ad hoc for every print circuit board, using a special detector and thermocouples.

This advanced technology not only assures maximum quality for every piece produced, but also guarantees an actual assembly capacity of 25,000 SMD components per hour.

INSPECTION AND CONTROL

EL.C.A. in view of always guaranteeing maximum reliability in every single phase of their production, thanks to important investments in resources in the assembly and testing sectors is today able to offer an inspection service, with x-ray technology, that allows the verification of correct positioning and soldering of CSP, BGA, and uBGA.


     

     

 

OPTICAL INSPECTION
To verify the SMT mounting “in paste” and “in spot glueing”, EL.C.A uses an optical inspection test to verify the mounting, the soldering and the polarity of all mounted components.

 
     
 

This technological solution, applied to all assembled print circuit boards, has enabled the company to reach a high quality standard, decreasing the testing and repair time of the print circuit boards that during the control phase don’t result as corresponding to the prearranged parameters.

 

  TECHNOLOGY PARK    

Screen Printing Machines:
- 1 Speedrint AV880
- 1 DEK Ela Avi

Spot Glueing Machines:
- 1 Two headed Yamaha I-Pulse D1
- 1 Two headed Tenryu Technics

Pick and Place:
- 2 Six headed Yamaha I-Pulse M1 PLUS
- 2 Six headed Yamaha I-Pulse M2

Ovens:
- 1 Iemme PLUS 12
- 1 Iemme PLUS 16 (in nitrogen inert atmosphere)
- 1 Iemme PLUS 16 N12 (in nitrogen inert atmosphere)

Optical Inspection:
- 1 Saki
- 1 Microscope Vision 100X

X-Ray Inspection:
- 1 Phoenix X-Ray pcba Analyser

Reprocessing:
- 1 Ersa IR550





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